• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    A printed circuit board (1) having a layer structure comprising at least first and second metallic layers (2, 3, 4, 5) and metallic layers (6, 7, 8) of insulating composite material and having a plurality of metallic vias ( 11..16) between at least one first and at least one second metallic layer, wherein at least one point of the printed circuit board (1) a central, by at least one layer (7) extending sleeve-shaped through-hole (17) is provided, which on both sides at an upper and / or the lower end of composite material ends and the cylindrical cavity (17h) is filled with a material and at least one end of the central via at a distance (d) from this at least two massive vias (18, 19) are provided, which with the central through-hole in the end region in metallic connection, run through an end position of composite material and to a metallic layer (2; 2.5) on a surface of the circuit board.
    公开号:AT520105A1
    申请号:T50506/2017
    申请日:2017-06-16
    公开日:2019-01-15
    发明作者:Edlinger Erik
    申请人:Zkw Group Gmbh；
    IPC主号:
    专利说明:

    The invention relates to a printed circuit board with a layer structure which has at least a first and a second metallic layer and layers separating metallic layers made of an insulating composite material and with a plurality of metallic plated-through holes between at least a first and at least a second metallic layer.
    In the electronics industry, multilayer printed circuit boards, for example FR4 circuit boards, are often used, which must be very densely populated on both sides. Would you now like to thermally optimize such a circuit board by using thermal
    Vias, also called "thermal vias", often creates the problem that conventional vias are not sufficiently thermally efficient. The arrangement of plated-through holes (vias) is often carried out arbitrarily, partly fully or semi-automatically and often only leads to moderate results with regard to optimal heat dissipation from electronic components. It should be noted that such plated-through holes can of course also be used for the electrical connection of conductor track sections in different positions.
    State-of-the-art solutions have been developed that are often very complex and, above all, very expensive to manufacture. For example, Fig. 1 shows so-called "staggered vias" whereas Fig. 2 shows another solution, namely a so-called "stack via". In both cases, a printed circuit board 1 is shown, which in the present case has four metallic layers 2, 3, 4, 5 and three layers 6, 7, 8 made of an insulating composite material. The metallic layers 2, 3, 4, 5 usually consist of copper and generally have a structuring with conductor tracks, soldering eyes, etc. that is adapted to the respective purpose. The layers 6, 7, 8 made of insulating composite material separate the metallic layers and consist, for example, of FR-4, a material made of epoxy resin and glass fiber fabric. The outermost layers, i.e. the top layer 9 and bottom layer 10 in the drawing are, for example, layers of solder resist.
    / 21
    P16079
    The metallic vias 11, 12 and 13 of Fig. 1 connect the metallic layers 2 and 3 (vias 11), the metallic layers 3 and 4 (vias 11) and the metallic layers 4 and 5, i.e. this
    Vias 11, 12, 13 are staggered. The two plated-through holes 11 and 13 are solid plated-through holes, the plated-through hole 12, on the other hand, is sleeve-shaped, its interior being filled with the composite material.
    The metallic vias 14, 15 and 16 of FIG. 2, on the other hand, connect all three metallic layers 2, 3, 4 in a stacked manner.
    The primary task of the metallic plated-through holes is that of electronic components which are attached to an outer metallic layer e.g. 1 and 2 to dissipate locally generated heat, an electrically conductive connection between connected sections of the metallic layers also being produced.
    Although stack vias (FIG. 2) promise very good thermal performance, circuit boards with such plated-through holes are far more expensive than conventional FR4 circuit boards or even more expensive than IMS (Insulated Metal Substrate) circuit boards. Staggered vias (FIG. 1) are cheaper in price than stack vias, but provide losses in thermal performance compared to stack vias. In order to generate stack vias, a plating or planarization step must be introduced between each hole, which is usually done with a laser, which fills the holes with copper or straightens protruding unevenness. This is necessary because a reflective layer must be present so that the laser beam does not penetrate too deeply into the previously drilled hole. This takes a lot of process time and is therefore very expensive. With staggered vias, this can be achieved without a plating or planarization step, since you are not drilling directly on the existing via, but rather slightly offset from it. However, such a step shape takes up a lot of space and has a far poorer thermal performance compared to stack vias, because with each additional via you move away from the point from which heat is to be dissipated ("hotspot"), so that long distances for heat dissipation be generated.
    / 21
    P16079
    It is an object of the invention to provide a printed circuit board with a number of layers of an insulating composite material and with a plurality of thermal, metallic plated-through holes, which on the one hand allows cost-effective production and which on the other hand has high performance in terms of heat dissipation from critical points (hot components, Hotspots) on the surface of the circuit board.
    This object is achieved with a printed circuit board of the type mentioned at the outset, in which, according to the invention, at least one point on the printed circuit board is provided with a central sleeve-shaped through-contact extending through at least one layer, which ends on both sides at an upper and / or lower end position made of composite material and whose cylindrical cavity is filled with a material and at least one solid via is provided on at least one end of the central via at a distance from it, which are in metallic connection with the central via in its end region, extend through an end position made of composite material, and up to one Guide the metal layer on one surface of the circuit board.
    In an advantageous variant, it is provided that the solid vias run rotationally symmetrically with respect to the central sleeve-shaped vias, since this results in a uniform thermal load on the printed circuit board and the risk of heat-related distortions is reduced.
    If it is provided that the solid plated-through holes are provided at both ends of the central sleeve-shaped plated-through hole, both on the upper side and on the lower side of the printed circuit board, through an end position made of composite material, particularly good heat dissipation results.
    It is particularly expedient if the arrangement of the plated-through holes is symmetrical with respect to a central plane of the printed circuit board, since such symmetry also reduces the risk of warping etc. on the printed circuit board.
    / 21
    P16079
    If the solid vias are tapered from the outside to the inside, which is the case when the necessary holes are made using a laser, this is advantageous for “filling” the holes with copper.
    In practice it is useful if the diameter of the massive
    Vias are one third to one fifth of the diameter of the central vias, since this results in a good distribution of the heat conduction to the individual vias.
    The composite material is expediently FR4.
    The metal for the plated-through holes is likewise preferably copper.
    Arrangements are particularly effective in which the mutual spacing of the vias is selected such that adjacent central vias each have massive vias in common. In this way, optimally “dense” configurations of the plated-through holes can be achieved.
    The invention and further advantages are explained in more detail below on the basis of exemplary embodiments which are illustrated in the drawing. In this show
    1 and 2 two versions of printed circuit boards with metal plated-through holes, namely “staggerd vias” and “stacked vias” according to the prior art,
    3 shows in section a first embodiment of the invention along the line III-III of Figure 5,
    4 in section a second embodiment of the invention,
    5 shows a plan view of a section of a printed circuit board according to the invention with four solid through-contacts arranged rotationally symmetrically around a central through-contact, the top layer of composite material being removed in the drawing for better illustration, and / 21
    P16079
    Fig. 6 is a view like Fig. 5, but a modified embodiment with six solid vias.
    In the following description of the invention, the same reference numerals are used for the same or comparable elements in order not to make the description and the figures unnecessarily complicated.
    The term “through-plating” does not necessarily mean a contact, be it thermal and / or electrical in nature, through all layers of a conductor track, rather it also includes contacts or vias through only one or more layers of the circuit board.
    Terms relating to the location or an orientation, such as “above”, “below”, “in front”, “below”, “above” etc. are only chosen in the description for the sake of simplicity and may not refer to the representation in the drawing however, necessarily in a position of use or installation. In particular, the terms top and bottom in this description and the claims relate only to the illustration in the drawing and are not to be understood as limiting. The circuit board can of course also be used in all other possible orientations, such as vice versa, standing or at an angle, or installed in devices.
    The term “electronic component” is to be understood in such a way that it should include all components that can be electrically connected to conductor tracks, such as chips that contain integrated circuits, digital or analog processors, but also simpler components, such as LEDs, resistors and the like ,
    Referring now to FIG. 3, which shows a first exemplary embodiment of the invention, a circuit board 1 can be seen with a layer structure which is similar to that of FIGS. 1 and 2, but of course other layer structures are possible within the scope of the invention. In the exemplary embodiment shown, at least one location on the printed circuit board 1, of which only a small section is shown, is a central sleeve-shaped through-contact 17 which extends through at least one layer, here the layer 7, which is on both sides of an upper, here of the Layer 6 and at a lower layer, here at layer 8, of composite material ends, their cylindrical cavity and their cylindrical / 21
    P16079
    Cavity 17h is filled with composite material. It should be noted here that in certain cases this cavity 17h can also be filled with a metal, generally with copper.
    In the example shown, at least two massive plated-through holes 18 are provided at the upper end of the central plated-through hole 17 at a distance d therefrom, which are in metallic connection with the central plated-through hole 17 in its upper end region via the layer 3, by an end position made of composite material, namely the layer 6, run and lead to the metallic layer 2 on the upper surface of the circuit board 1. The above-mentioned distance d is measured here between the axes of the plated-through holes 18 and the axis of the central plated-through hole 17.
    In the second exemplary embodiment of a printed circuit board 1 according to the invention, a section of which is shown in FIG. 4, an arrangement of vias which extends through the entire thickness of the printed circuit board is provided. In this embodiment, the upper half of the embodiment according to FIG. 3 is mirrored around the center plane ε of the printed circuit board 1, so that a total of four massive through-contacts are provided, surrounding the central via at a distance d, the lower through-contacts, as it were, indicated by 19 are. These are in metallic connection with the central plated-through hole 17 in its lower end region via the layer 4, run through an end position made of composite material, namely the layer 8, and lead to the metallic layer 5 on the lower surface of the printed circuit board 1.
    As far as the manufacture of a printed circuit board according to the invention is concerned, a non-restrictive possibility is that starting from a two-layered one
    PCB substrate, the central holes for central plated-through holes 17 are mechanically produced and then copper-plated in an electrochemical process, i.e. be filled with copper. Then, by selective etching away, the
    Printed circuit board image of the inner layers. By pressing prepregs, a resin layer with another copper layer on the outside is applied on both sides. Due to the high pressure and the resulting temperature, the cavities in the bore are filled with resin and a bond is created that has no air pockets. Using a laser, those holes are now made which / 21
    P16079 form the basis for the solid vias 18 and 19, and which must always end on a planar copper layer due to the laser process.
    In practice, the production of bores by means of laser radiation leads to conical bores, which can be seen clearly in FIGS. 1 to 4 by the solid vias. Alternatively, a precise mechanical deep hole can be used, in which case the holes would not be conical but cylindrical.
    However, this process is generally expensive and not recommended due to its complexity. The drilled vias are then electrochemically copper-plated and then the printed circuit board image of the outer layers is transferred and etched using photolithography, as previously for the inner layers. The solder resist and, if necessary, an inscription layer are then applied by screen printing. In a final step, a metal finish can be applied, for example wet-chemical electroplating with nickel and gold.
    With regard to the dimensions used in practice, exemplary values are to be given below, which, however, are not to be regarded as limiting, as are the material information, insofar as they come within the scope of the claims. The thickness of the prepregs, namely the layers 6, 7, 8, is usually between 63 gm and 250 gm (micrometers), with that of the middle layer 7 preferably being 120 gm to 1 mm. The diameter of the solid vias 18 is between 70 gm and 300 gm, preferably between 100 gm and 150 gm and the diameter of the central via 17 between 100 gm and 20 mm (millimeters), preferably between 300 gm and 500 gm. The thickness of the metallic layers 2, 3, 4, 5, they are usually copper layers, for example 35 gm, 70 gm or 105 gm. The wall thickness of the central via 17, thus the thickness of the sleeve wall, is for example between 16 gm to 39 gm (micrometers).
    3 and 4 only show sections through a small section of the circuit board 1. In practical embodiments, a number of plated-through holes are in fact provided in a circuit board in the arrangement according to the invention, which will be explained below.
    / 21
    P16079
    5 shows a larger section of a printed circuit board 1 on which an LED component 20 is arranged. The contact areas (pads) 21, 22 of the component 20, with which the LED component 20 is electrically connected to conductor track structures of the printed circuit board 1, are shown in broken lines. The light emission surface of the LED component 20 is designated by 23.
    5 shows a regular pattern of here twenty central, sleeve-shaped vias 17 and twenty massive vias 18. Here, four massive vias 18 are always arranged rotationally symmetrically around a central via 17, so that cells 24 are formed , which are each formed from four solid vias 18 and a central via 17. The top views of this and the following figure also show exemptions 25 from solder mask as concentric circular rings around the solid plated-through holes 18.
    5 clearly shows an essential feature of the invention, namely the arrangement of a central via 17 with solid via 18 arranged around it, preferably in a rotationally shaped geometry. It should be noted that in the design according to FIG. 5, the mutual distances between the two types of plated-through holes are selected such that adjacent central ones
    Vias 17 each have massive vias 18 in common. If twenty central vias 17 were located at a greater distance from one another, this would result in a total of eighty massive vias 18 as “satellites”.
    The representation according to FIG. 6 corresponds in principle to that according to FIG. 5, but here there is a hexagonal pattern, that is to say an arrangement with a central via 17 each, around which six massive through contacts 18 are arranged in a rotating geometry. The corresponding cells 26 are accordingly hexagonal. The solid plated-through holes 18 have smaller diameters here than those of FIG. 5. In addition, no solder resist exemptions are shown in FIG. 6. Again, as shown in FIG. 5, the mutual distances between the two types of vias are selected such that adjacent central vias 17 each have massive vias 18 in common.
    / 21
    P16079
    If the cells were at a sufficient distance from each other, there would be six times as many solid vias as central vias.
    It has been shown that a particularly favorable ratio of the diameter of the solid plated-through holes 18 to the central plated-through holes 17 is essentially 1: 2 or even larger. In the best case scenario, each solid via has the same thermal conductivity as the associated central via. This is approximately the case when the cross section of the metallic filling of the solid via has the same area as the area of the cross section of the metallic lining (sleeve) of the central via. Due to the larger radius and circumference of the central through-plating, the layer thickness of the lining can be smaller and can therefore be produced in a cheaper way, for example by means of galvanization.
    It is understood that different arrangements of vias on a printed circuit board are possible within the scope of the invention, in the simplest case a single central via 17 with e.g. three, four, five, six and more "satellites", i.e. massive plated-through holes 18 can be provided. Cases with the densest arrangements, however, are shown in FIGS. 5 and 6.
    / 21 of the reference numerals
    circuit board 15 via metallic layer 16 via metallic layer 17 Vias, sleeve-shaped metallic layer 17h cavity metallic layer 18 massive through-plating Composite layer 19 massive through-plating Composite layer 20 LED component Composite layer 21 contact area top layer 22 contact surface lowest layer 23 Light emitting surface via 24 cell via 25 exemptions via 26 cell via
    / 21
    权利要求:
    Claims (12)
    [1]
    1. Printed circuit board (1) with a layer structure which has at least a first and a second metallic layer (2, 3, 4, 5) and layers separating metallic layers (6, 7, 8) made of an insulating composite material and with a plurality of metallic plated-through holes (11..16) between at least a first and at least a second metallic layer, characterized in that a central sleeve-shaped through-contact (17), which extends through at least one layer (7), is provided at at least one location on the printed circuit board (1) ends on both sides at an upper and / or lower end position made of composite material and whose cylindrical cavity (17h) is filled with a material and at least two solid through-contacts (18, 19) are provided at at least one end of the central via at a distance (d) from the latter , which are in a metallic connection with the central via in their end area, through an end position made of composite run and up to a metallic layer (2; 2.5) on one surface of the circuit board.
    [2]
    2. Printed circuit board according to claim 1, characterized in that the solid
    Vias (18) run rotationally symmetrically with respect to the central sleeve-shaped vias (17).
    [3]
    3. Printed circuit board according to claim 1 or 2, characterized in that the solid plated-through holes (18) are provided at both ends of the central sleeve-shaped plated-through hole (17) both on the upper side and on the lower side of the printed circuit board (1) by an end position (6 , 8) run from composite material.
    [4]
    4. Printed circuit board according to claim 3, characterized in that the arrangement of the plated-through holes (17, 18) is symmetrical with respect to a central plane (ε) of the printed circuit board.
    12/21
    P16079
    [5]
    5. Printed circuit board according to one of claims 1 to 4, characterized in that the solid vias (18) taper from the outside inwards.
    [6]
    6. Printed circuit board according to one of claims 1 to 5, characterized in that the diameter of the solid vias (18) is one third to one fifth of the diameter of the central via.
    [7]
    7. Printed circuit board according to one of claims 1 to 6, characterized in that the composite material is FR4.
    [8]
    8. Printed circuit board according to one of claims 1 to 7, characterized in that the metal for the plated-through holes is copper.
    [9]
    9. Printed circuit board according to one of claims 1 to 8, characterized in that the cylindrical cavity (17h) of the central sleeve-shaped via (17) is filled with a composite material.
    [10]
    10. Printed circuit board according to one of claims 1 to 8, characterized in that the cylindrical cavity of the central sleeve-shaped via (17) is filled with copper.
    [11]
    11. Printed circuit board according to one of claims 1 to 8, characterized in that the at least two solid vias (18) consist of copper.
    [12]
    12. Printed circuit board according to one of claims 1 to 11, characterized in that the mutual spacings of the plated-through holes (17, 18) are selected such that adjacent central plated-through holes (17) each have massive plated-through holes (18) in common.
    类似技术:
    公开号 | 公开日 | 专利标题
    DE102004045719B4|2007-01-25|Printed circuit board test access point structures and methods of making the same
    DE3020196C2|1982-05-06|Multilevel printed circuit board and process for its manufacture
    DE102011077206B4|2019-01-31|Printed circuit board and control unit for a transmission of a vehicle with the printed circuit board
    EP1929847B1|2009-03-18|Printed board
    DE4020498C2|1995-03-16|Method for producing multiwire printed circuit boards with insulated metal conductors and / or optical conductors
    AT520105B1|2019-10-15|circuit board
    EP0451541A1|1991-10-16|Fabrication of multilayer circuit boards with increased conductor density
    DE102009027530A1|2011-01-20|circuit board
    DE4326104A1|1995-02-09|Electrical assembly
    DE19650492A1|1997-06-12|Multi-layer circuit board with connectors for plating or metallisation of contacts and terminals
    DE102017202329A1|2018-08-16|Multilayer printed circuit board and electronic arrangement with such
    DE102012223287A1|2014-06-18|Printed circuit board for accommodating electronic element i.e. LED, has electrically insulated layer comprising openings for guiding connection unit, where core and/or connection unit and/or conductors are partially made from copper
    AT520301B1|2019-03-15|PROCESS FOR PRODUCING A PCB WITH THERMAL CONTACT, AND PCB
    DE102014116522B4|2021-10-14|Structures to protect against solder bridges in printed circuit boards, semiconductor packages and semiconductor assemblies
    DE102014202196B3|2015-03-12|Printed circuit board and circuit arrangement
    WO2020120287A1|2020-06-18|Substrate, assembly comprising a substrate, and method for producing a substrate
    EP3066898B1|2017-08-23|Printed circuit board
    DE1926590A1|1969-12-11|Multi-layer printed circuit board and method for making same
    DE102015001652A1|2016-08-18|Method of making a via in a multilayer printed circuit board
    DE102014224732B4|2022-02-10|Printed circuit board for a motor vehicle lighting device with optimized heat dissipation
    DE102020102983A1|2021-08-05|Component carrier for arranging electrical components on a circuit board
    DE10223203A1|2003-12-04|Electronic component module and method for its production
    DE69937357T2|2008-07-24|METHOD FOR VERY RIGHT CONNECTION OF LADDERS IN A MICROWAVE ARRANGEMENT
    DE102019108870A1|2020-10-08|Carrier with reduced through-hole
    EP3525558A1|2019-08-14|Conductor board
    同族专利:
    公开号 | 公开日
    CN109152202A|2019-01-04|
    EP3416462A1|2018-12-19|
    AT520105B1|2019-10-15|
    CN109152202B|2021-06-04|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    JP2000244129A|1998-12-25|2000-09-08|Ngk Spark Plug Co Ltd|Wiring board, core board, and their manufacture|
    US6333857B1|1998-12-25|2001-12-25|Ngk Spark Plug Co., Ltd.|Printing wiring board, core substrate, and method for fabricating the core substrate|
    EP1035581A2|1999-03-10|2000-09-13|Shinko Electric Industries Co. Ltd.|Multilayer wiring board|
    JP2002151847A|2000-08-29|2002-05-24|Ngk Spark Plug Co Ltd|Wiring substrate and method of manufacturing the same|
    US20030070839A1|2001-10-16|2003-04-17|Boyko Christina M.|Interconnect structure and method of making same|
    EP1615485A1|2003-04-07|2006-01-11|Ibiden Co., Ltd.|Multilayer printed wiring board|
    EP1713313A1|2004-02-04|2006-10-18|Ibiden Co., Ltd.|Multilayer printed wiring board|
    US20080251285A1|2007-04-10|2008-10-16|Motohiko Sato|Capacitor and wiring board including the capacitor|
    US20090095521A1|2007-10-12|2009-04-16|Fujitsu Limited|Circuit board and method of manufacturing the same|
    US20100006334A1|2008-07-07|2010-01-14|Ibiden Co., Ltd|Printed wiring board and method for manufacturing the same|
    WO2017096167A1|2015-12-02|2017-06-08|Multek Technologies Limited|Pcb hybrid redistribution layer|
    US6753612B2|2001-04-05|2004-06-22|International Business Machines Corporation|Economical high density chip carrier|
    EP1465471A3|2003-04-03|2005-07-27|Matsushita Electric Industrial Co., Ltd.|Wiring board, method for manufacturing a wiring board and electronic equipment|
    CN1926930B|2004-03-03|2011-06-15|新光电气工业株式会社|Circuit board manufacturing method and circuit board|
    US8319111B2|2006-10-04|2012-11-27|Ngk Spark Plug Co., Ltd.|Wiring board having wiring laminate portion with via conductors embedded in resin insulating layers|
    JP2009200212A|2008-02-21|2009-09-03|Keihin Corp|Heat radiation structure of printed circuit board|
    DE102009058914A1|2009-12-17|2011-06-22|Conti Temic microelectronic GmbH, 90411|High density interconnect-multi layered printed circuit board, has upper and lower board layers with conducting layers, where total surface of conducting layer of upper layer is larger than total surface of conducting layer of lower layer|US10980127B2|2019-03-06|2021-04-13|Ttm Technologies Inc.|Methods for fabricating printed circuit board assemblies with high density via array|
    法律状态:
    优先权:
    申请号 | 申请日 | 专利标题
    ATA50506/2017A|AT520105B1|2017-06-16|2017-06-16|circuit board|ATA50506/2017A| AT520105B1|2017-06-16|2017-06-16|circuit board|
    EP18176554.6A| EP3416462A1|2017-06-16|2018-06-07|Conductor board|
    CN201810619886.6A| CN109152202B|2017-06-16|2018-06-15|Printed circuit board|
    [返回顶部]